Team Group

Team Group TTZD416G3200HC16F Memory Module Computer Component

TTZD416G3200HC16F

Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.

A computer's memory which is directly accessible to the CPU.

How the overall memory of the product is put together, defined by the number of modules and the size.

The type of internal memory such as RAM, GDDR5.

The frequency at which the memory (e.g. RAM) runs.

What this product is used as a part of (component for).

Design of the memory e.g. 240-pin DIMM, SO-DIMM.

The voltage (V) of the memory in the device.

The method used to cool the device or to cool the air around the device.

The measurement or extent of something from side to side.

The distance from the front to the back of something.

The measurement of the product from head to foot or from base to top.

Team Group T-FORCE ZEUS TTZD416G3200HC16F. Component for: Notebook, Internal memory: 16 GB, Memory layout (modules x size): 2 x 8 GB, Internal memory type: DDR4, Memory clock speed: 3200 MHz, Memory form factor: 260-pin SO-DIMM, CAS latency: 16

Team Group T-FORCE ZEUS TTZD416G3200HC16F, 16 GB, 2 x 8 GB, DDR4, 3200 MHz, 260-pin SO-DIMM

Team Group TTZD416G3200HC16F Memory Module Computer Component

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Team Group T-FORCE ZEUS TTZD416G3200HC16F memory module 16 GB 2 x 8 GB DDR4 3200 MHz

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