Hiksemi

Hiksemi HIKER/U/DDR4/4G/2666 Memory Module Computer Component

HIKER/U/DDR4/4G/2666

Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.

A computer's memory which is directly accessible to the CPU.

How the overall memory of the product is put together, defined by the number of modules and the size.

The type of internal memory such as RAM, GDDR5.

The frequency at which the memory (e.g. RAM) runs.

What this product is used as a part of (component for).

Design of the memory e.g. 240-pin DIMM, SO-DIMM.

ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.

The voltage (V) of the memory in the device.

The colour e.g. red, blue, green, black, white.

The method used to cool the device or to cool the air around the device.

The minimum and maximum temperatures at which the product can be safely operated.

The measurement or extent of something from side to side.

The distance from the front to the back of something.

The measurement of the product from head to foot or from base to top.

Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.

Hiksemi HIKER/U/DDR4/4G/2666. Component for: PC, Internal memory: 4 GB, Memory layout (modules x size): 1 x 4 GB, Internal memory type: DDR4, Memory clock speed: 2666 MHz, Memory form factor: 288-pin DIMM, CAS latency: 19, Product colour: Black

Hiksemi HIKER/U/DDR4/4G/2666, 4 GB, 1 x 4 GB, DDR4, 2666 MHz, 288-pin DIMM, Black

Hiksemi HIKER/U/DDR4/4G/2666 Memory Module Computer Component

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Description

Product Features:

Hiksemi HIKER/U/DDR4/4G/2666 memory module 4 GB 1 x 4 GB 2666 MHz

Specification

Features

Operational conditions

Weight & dimensions