The EIB326 is a combination of a energy saving server for all kind of applications requiring a stable platform based on an Intel serverboard and a large variaty of CPU's from Pentium to XEON. This makes it an ideal server for industrial applications, PABX server, building automation, IP-security installations and entry-level Small Business Server. The power consumption is approx 50 Watt depending on the configuration.
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Description
Specification
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Description
Product Features:
- Intel® Xeon® L3360 2.83 GHz
- 4 GB 800 MHz DDR2-SDRAM
- 20.5 TB DVD-RW
- Rack (3U)
Warranty: 3 years carry-in. Advanced replacement and on-site service contract are available.
ECOserver EIB326L3360, 3U , w/ Intel XEON L3360, 2GB server 20.5 TB Rack (3U) Intel® Xeon® 2.83 GHz 4 GB DDR2-SDRAM
EIB326L3360, 3U server, w/ Intel XEON L3360, 2GB
ECOserver EIB326L3360, 3U server, w/ Intel XEON L3360, 2GB, 2.83 GHz, L3360, 4 GB, DDR2-SDRAM, 20.5 TB, Rack (3U)
ECOserver EIB326L3360, 3U server, w/ Intel XEON L3360, 2GB. Processor family: Intel® Xeon®, Processor frequency: 2.83 GHz, Processor model: L3360. Internal memory: 4 GB, Internal memory type: DDR2-SDRAM. Total storage capacity: 20.5 TB, HDD interface: Serial ATA, Optical drive type: DVD-RW. Chassis type: Rack (3U)
Specification
Processor
Processor manufacturer
Intel
Processor family
Intel® Xeon®
Processor model
L3360
Processor frequency
2.83 GHz
Processor cores
4
Processor cache
12 MB
Motherboard chipset
Intel® 3200
Number of processors installed
1
Thermal Design Power (TDP)
65 W
Processor cache type
L2
Processor front side bus
1333 MHz
Processor socket
LGA 775 (Socket T)
Processor lithography
45 nm
Processor threads
4
Processor operating modes
64-bit
Stepping
E0
FSB Parity
No
Bus type
FSB
Processor codename
Yorkfield
Tcase
76.25 °C
ECC supported by processor
No
Execute Disable Bit
Yes
Thermal Monitoring Technologies
No
Processor code
SLGPF
Embedded options available
No
Number of Processing Die Transistors
820 M
CPU multiplier (bus/core ratio)
8.5
Processing Die size
214 mm²
Processor series
Intel Xeon 3300 Series
Conflict-Free processor
No
Memory
Internal memory
4 GB
Internal memory type
DDR2-SDRAM
Memory slots
4
Memory clock speed
800 MHz
Maximum internal memory
8 GB
Storage
Total storage capacity
20.5 TB
HDD interface
Serial ATA
RAID levels
5, 10
Hot-swap
No
Optical drive type
DVD-RW
Graphics
Maximum graphics card memory
128 MB
Network
Networking features
10/100/1000 Mbps
Ports & interfaces
Ethernet LAN (RJ-45) ports
1
USB 2.0 ports quantity
2
PS/2 ports quantity
2
VGA (D-Sub) ports quantity
1
Serial ports quantity
1
Expansion slots
PCI Express x4 slots
1
PCI Express x8 slots
1
PCI slots
2
Design
Chassis type
Rack (3U)
Rack mounting
Yes
Software
Compatible operating systems
Windows XP Pro
Microsoft Windows Server 2003/2008
SuSE Linux Ent. Server 10 32/64 bit
RedHat Ent. Linux 5.0 AS, 32/64 bit
Novell NetWare 6.5
Processor special features
Intel Rapid Storage Technology
No
Enhanced Intel SpeedStep Technology
Yes
Intel® Wireless Display (Intel® WiDi)
No
Intel Virtualization Technology for Directed I/O (VT-d)
No
Intel® Anti-Theft Technology (Intel® AT)
No
Intel® Hyper Threading Technology (Intel® HT Technology)
No
Intel® My WiFi Technology (Intel® MWT)
No
Intel® Turbo Boost Technology
No
Intel® Quick Sync Video Technology
No
Intel® InTru™ 3D Technology
No
Intel® Clear Video HD Technology (Intel® CVT HD)
No
Intel® Insider™
No
Intel Flex Memory Access
No
Intel® AES New Instructions (Intel® AES-NI)
No
Intel Trusted Execution Technology
No
Intel Enhanced Halt State
No
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel Demand Based Switching
No
Intel Clear Video Technology
No
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)
No
Intel 64
Yes
Intel Virtualization Technology (VT-x)
Yes
Intel Dual Display Capable Technology
No
Intel FDI Technology
No
Intel Fast Memory Access
No
Processor ARK ID
40481
Power
Power supply type
FSP-270-60LE 80PLUS
Power requirements
115-230VAC@47-63Hz
Redundant power supply (RPS) support
No
Power consumption (typical)
50 W
Operational conditions
Operating temperature (T-T)
10 - 30 °C
Storage temperature (T-T)
-20 - 50 °C
Operating relative humidity (H-H)
10 - 90%
Storage relative humidity (H-H)
5 - 95%
Operating altitude
0 - 3000 m
Non-operating altitude
0 - 9000 m
Weight & dimensions
Width
484 mm
Depth
400 mm
Height
132 mm
Weight
8 kg
Features
Images Type Map
<div><img src="https://ark.intel.com/inc/images/diagrams/diagram-5.gif" title="Block Diagram" /></div>
Other features
Acoustic pressure emissions
60 dB
Storage drive controller
SATA 3Gb/s
Power availability
270 W
Dimensions (WxDxH)
484 x 400 x 132 mm
Number of drive bays
2x 2.5" 8x 3.5"
Drive bays
10
Dimensions (W x D x H) (imperial)
485.1 x 398.8 x 132.1 mm (19.1 x 15.7 x 5.2")
Manageability features
IPMI 2.0
Video modes resolution
1600 pixels
Graphics card memory type
GDDR2
Weight (imperial)
7.98 kg (17.6 lbs)