The EDMT28 is new generation server, specially designed for SME environments where space and noise-level have to be limited. With its very low energy consumpltion it makes it an ideal solution for environment up to 25 users where no 19 inch rack is available or the server has to placed on the work-floor. The power consumption is approx 50 Watt depending on the configuration.
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Description
Specification
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Description
Product Features:
- Intel® Xeon® 3000 Sequence L3426 1.86 GHz
- 4 GB 1333 MHz
- 20.5 TB DVD-RW
- Tower
Warranty: 3 years carry-in. Advanced replacement and on-site service contract are available.
ECOserver EDMT28L3426, Tower , w/ Intel XEON L3426, 2GB server 20.5 TB Intel® Xeon® 3000 Sequence 1.86 GHz 4 GB
EDMT28L3426, Tower server, w/ Intel XEON L3426, 2GB
ECOserver EDMT28L3426, Tower server, w/ Intel XEON L3426, 2GB, 1.86 GHz, L3426, 4 GB, 20.5 TB, DVD-RW, Tower
ECOserver EDMT28L3426, Tower server, w/ Intel XEON L3426, 2GB. Processor family: Intel® Xeon® 3000 Sequence, Processor frequency: 1.86 GHz, Processor model: L3426. Internal memory: 4 GB. Total storage capacity: 20.5 TB, HDD interface: Serial ATA, Optical drive type: DVD-RW. Redundant power supply (RPS) support. Chassis type: Tower
Specification
Processor
Processor manufacturer
Intel
Processor family
Intel® Xeon® 3000 Sequence
Processor model
L3426
Processor frequency
1.86 GHz
Processor boost frequency
3.2 GHz
Processor cores
4
Processor cache
8 MB
Motherboard chipset
Intel® 3400
Memory channels supported by processor
Dual
Number of processors installed
1
Thermal Design Power (TDP)
45 W
Processor cache type
Smart Cache
System bus rate
2.5 GT/s
Processor socket
LGA 1156 (Socket H)
Processor lithography
45 nm
Processor threads
8
Processor operating modes
64-bit
Stepping
B1
FSB Parity
Bus type
DMI
Processor codename
Lynnfield
Tcase
58.3 °C
Maximum internal memory supported by processor
32 GB
Memory types supported by processor
DDR3-SDRAM
Memory clock speeds supported by processor
800,1066,1333 MHz
Memory bandwidth supported by processor (max)
21 GB/s
ECC supported by processor
Execute Disable Bit
Idle States
Thermal Monitoring Technologies
Maximum number of PCI Express lanes
16
PCI Express configurations
1x16, 2x8, 4x4
Processor package size
37.5 x 37.5 mm
Supported instruction sets
SSE4.2
Physical Address Extension (PAE)
36 bit
Embedded options available
Number of Processing Die Transistors
774 M
CPU multiplier (bus/core ratio)
14
Processing Die size
296 mm²
Processor series
Intel Xeon 3400 Series
Conflict-Free processor
Memory
Internal memory
4 GB
Memory slots
6
Memory clock speed
1333 MHz
Maximum internal memory
32 GB
Storage
Total storage capacity
20.5 TB
HDD interface
Serial ATA
RAID levels
5, 10
Hot-swap
Optical drive type
DVD-RW
Graphics
Maximum graphics card memory
64 MB
Network
Networking features
10/100/1000 Mbps
Ports & interfaces
Ethernet LAN (RJ-45) ports
2
USB 2.0 ports quantity
2
VGA (D-Sub) ports quantity
1
Serial ports quantity
1
Expansion slots
PCI Express x4 slots
1
PCI Express x8 slots
2
PCI slots
1
PCI Express slots version
2.0
Design
Chassis type
Tower
Software
Compatible operating systems
Windows XP Pro
Microsoft Windows Server 2003/2008
SuSE Linux Ent. Server 10 32/64 bit
RedHat Ent. Linux 5.0 AS, 32/64 bit
Novell NetWare 6.5
Processor special features
CPU configuration (max)
1
Intel Rapid Storage Technology
Enhanced Intel SpeedStep Technology
Intel® Wireless Display (Intel® WiDi)
Intel Virtualization Technology for Directed I/O (VT-d)
Intel® Anti-Theft Technology (Intel® AT)
Intel® Hyper Threading Technology (Intel® HT Technology)
Intel® My WiFi Technology (Intel® MWT)
Intel® Turbo Boost Technology
1.0
Intel® Quick Sync Video Technology
Intel® InTru™ 3D Technology
Intel® Clear Video HD Technology (Intel® CVT HD)
Intel® Insider™
Intel Flex Memory Access
Intel® AES New Instructions (Intel® AES-NI)
Intel Trusted Execution Technology
Intel Enhanced Halt State
Intel VT-x with Extended Page Tables (EPT)
Intel Demand Based Switching
Intel Clear Video Technology
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)
Intel 64
Intel Virtualization Technology (VT-x)
Intel Dual Display Capable Technology
Intel FDI Technology
Intel Fast Memory Access
Processor ARK ID
43233
Power
Power supply type
Antec
Power requirements
100-240VAC, 47-63Hz
Redundant power supply (RPS) support
Power consumption (typical)
50 W
Operational conditions
Operating temperature (T-T)
10 - 30 °C
Storage temperature (T-T)
-20 - 50 °C
Operating relative humidity (H-H)
10 - 90%
Storage relative humidity (H-H)
5 - 95%
Operating altitude
0 - 3000 m
Non-operating altitude
0 - 9000 m
Weight & dimensions
Width
220 mm
Depth
600 mm
Height
450 mm
Weight
9 kg
Features
Images Type Map
<div><img src="https://ark.intel.com/inc/images/diagrams/diagram-18.gif" title="Block Diagram" /></div>
Other features
Acoustic pressure emissions
60 dB
Storage drive controller
SATA 3 Gb/s
Dimensions (WxDxH)
220 x 600 x 450 mm
Number of drive bays
2x 2.5" 8x 3.5"
Drive bays
10
Dimensions (W x D x H) (imperial)
218.4 x 449.6 x 599.4 mm (8.6 x 17.7 x 23.6")
Manageability features
IPMI 2.0
Video modes resolution
1600 pixels
Graphics card memory type
GDDR2
Weight (imperial)
8.98 kg (19.8 lbs)